Researchers have designed a robust image-based anomaly detection (AD) framework with illumination enhancement and noise suppression features that can enhance the detection of subtle defects in ...

Modern advanced packaging processes and shrinking semiconductor device sizes mean that it is vital to consistently eliminate sub-20 nm defects and surface contaminants. To do this effectively, the ...

As advanced packaging pushes deeper into the sub-10µm realm, traditional inspection and metrology systems are being forced to evolve with it. Hybrid bonding, a critical enabler of vertical integration ...

The main objective of this project is to let students apply the image processing techniques that been taught in class in a given conditions based on their title. This particular project involved the ...

Innovative magnetic robots for steel bridge inspection utilize AI and advanced sensors, ensuring effective defect detection and structural health monitoring.